Reports from Korean Pulse News mentioned a strategic partnership in the artificial intelligence field between the giants TSMC and SK Hynix, in the electronic chip industry.
According to the reports, this partnership will focus on developing the next-generation high-bandwidth memory (HBM4) with excellent capabilities, a special type of memory used in high-performance computing devices like artificial intelligence processors.
It is expected to be first used in the advanced graphics processing unit B100 based on the Blackwell architecture, which Nvidia has high hopes for due to its use of Chiplet design. AMD also plans to use HBM4 memory in the upcoming generation for its Instinct graphics processing unit in 2025.
This partnership comes after both TSMC and SK Hynix considered Samsung a threat to their interests in the market. In this strategic collaboration, both companies aim to strengthen their presence in the rapidly growing artificial intelligence market, which is attracting increasing interest from major global technology companies.
This strategic partnership is believed to play a positive role in the development of HBM4 memory, as TSMC has extensive experience in semiconductor manufacturing, and SK Hynix has swiftly developed HBM3 and HBM3e memory with a large production volume.
By coordinating the efforts of both companies in developing AI-specific products as one team, this partnership is expected to enhance their competitiveness in the artificial intelligence market.
